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Curriculum
# Curriculum Map # Professional Tracks # Curriculum Plan
# Curriculum Maps
# Professional Tracks
1. IC Design Track
Focus:This track emphasizes the design, verification, and implementation of integrated circuits (ICs). Students learn digital and analog circuit design, FPGA programming, IC synthesis, and verification methodologies. The coursework covers the entire IC design flow, from schematic design to layout and testing.
Key Learning Areas:
- Digital & Analog IC Design
- FPGA Programming & VLSI Design
- IC Verification & Simulation
- Circuit Layout & Chip Prototyping
Graduates from this track can pursue careers in:
- IC Design Engineer – Designing and developing integrated circuits for various applications.
- Verification Engineer – Ensuring the functionality and reliability of chip designs.
- ASIC/FPGA Engineer – Implementing custom hardware solutions using ASIC or FPGA technology.
- SoC Engineer – Specializing in system-on-chip (SoC) development for high-performance computing and mobile devices.
2. Solid-State Semiconductor Devices Track
Focus:This track provides in-depth knowledge of semiconductor materials, fabrication processes, and device physics. Students gain hands-on experience in device simulation, semiconductor processing, and material characterization, allowing them to understand how electronic components function at the microscopic level.
Key Learning Areas:
- Semiconductor Physics & Materials Science
- Semiconductor Fabrication & Process Engineering
- Reliability & Failure Analysis of Semiconductor Devices
- Power Semiconductor & Wide-Bandgap Devices
Graduates from this track can work as:
- Semiconductor Process Engineer – Overseeing wafer fabrication and lithography processes.
- Device Engineer – Developing new semiconductor components, such as MOSFETs and power devices.
- Reliability Engineer – Ensuring long-term performance and durability of semiconductor devices.
- Materials Engineer – Researching and optimizing semiconductor materials for improved performance.
3. Semiconductor Smart Manufacturing Track
Focus:This track integrates AI, automation, and intelligent production systems to enhance efficiency in semiconductor manufacturing. Students learn how to apply big data analytics, IoT, and enterprise resource planning (ERP) systems to optimize semiconductor fabrication and packaging processes.
Key Learning Areas:
- Smart Factory & Industrial Automation
- Semiconductor Supply Chain & Production Management
- AI & Big Data Applications in Semiconductor Manufacturing
- Quality Control & Yield Optimization
Graduates from this track can work in:
- Smart Manufacturing Engineer – Implementing automation and AI-driven production processes.
- Production & Operations Engineer – Managing semiconductor fabrication, packaging, and testing.
- Supply Chain & Logistics Engineer – Optimizing the semiconductor supply chain with digital tools.
- Quality & Yield Engineer – Ensuring high production efficiency and minimal defects in semiconductor manufacturing.
# Curriculum Plan
Credits of Graduation: 128
類別 Category |
科目名稱 Course Title |
英文名稱 English Title |
修課年級 Year of the Program |
修課學期 Semester |
學分數 Credits |
每週上課時數 Hours per week |
備註 Remarks |
||||
講授 Lecture |
實作(驗) Practice (laboratory) |
實習 Intern |
|||||||||
校定必修30學分 (30) University Required Credits |
基礎通識22學分 (22) Program Required Credits |
中文領域 Chinese Category (4學分) (4 Credits) |
中文鑑賞與思辨 |
Chinese Appreciation and Critical Thinking → Chinese 1 |
一 1st |
上 1st |
2 | 2 | 0 | ||
中文表達與應用 |
Chinese Expression and Application → Chinese 2 |
一 1st |
下 2nd |
2 | 2 | 0 | |||||
英文領域 English Category (8學分) (8 Credits) |
共通英語文(一) | English for General Purposes (1) |
一 1st |
上 1st |
3 | 3 | 0 | ||||
共通英語文(二) | English for General Purposes (2) |
一 1st |
下 2nd |
3 | 3 | 0 | |||||
共通專業英語文:科技英文 English for General Specific Purposes: English for Science and Technology |
二 2nd |
上 1st |
2 | 2 | 0 | ||||||
程式領域 Information Category (4學分) (4 Credits) |
資訊科技概論 | Introduction to Information Technology |
一 1st |
上 1st |
2 | 2 | 0 | ||||
資訊與科技 | Information and Technology | ||||||||||
程式設計與智慧應用 | Computer Programming and Artificial Intelligence Application |
一 1st |
下 2nd |
2 | 2 | 0 | |||||
藝術領域 Esthetics Category (2學分) (2 Credits) |
設計思考與創新 | Design Thinking and Innovation |
一 1st |
下 2nd |
2 | 2 | 0 | ||||
美學素養 | Esthetics Accomplishment | ||||||||||
永續領域 Sustainable Category (2學分) (2 Credits) |
永續發展與實踐(一) | Sustainable Development and Practice (1) |
一 1st |
上 1st |
1 | 1 | 0 | ||||
永續發展與實踐(二) | Sustainable Development and Practice (2) |
一 1st |
下 2nd |
1 | 1 | 0 | |||||
博雅通識8學分 (8) Program Elective Credits |
博雅課程 (人文類、社會類、自然類、生活類) |
General Required (Core) Courses (Categories: Humanities, Society, Nature, Life) |
一~四 1st ~ 4th |
上、下 1st , 2nd |
8 | 0 | |||||
體育 Physical Program |
體育(一)~(四) | Physical Education (1)~(4) |
一~二 1st ~ 2nd |
上、下 1st , 2nd |
0 | 2 | 0 | ||||
涵養教育 Cultivation Education |
通識講座 General Lectures (Required) |
通識涵養教育 (健康、關懷、創新、卓越) |
General Literacy Series (Domains of Literacy: Healthy, Care, Innovation, Excellence) |
一~四 1st ~ 4th |
0 | 0 |
院核心課程9學分 (9)College Core Courses |
基礎程式設計 | Fundamental Computer Programming |
一 1st |
上 1st |
3 | 3 | |||
人工智慧與雲端應用 | Artificial Intelligence and Cloud Applications | 二 2nd |
上 1st |
3 | 3 | ||||
★畢業專題(一) | Special Projects (Ⅰ) | 三 | 下 2nd |
1 | 0 | ||||
★畢業專題(二) | Special Projects (Ⅱ) | 四 | 上 1s |
1 | 0 | ||||
★資訊研討 | Information System Seminar | 四 | 下 2nd |
1 | 1 |
類別 Category |
科目名稱 Course Title |
英文名稱 English Title |
修課年級 Year of the Program |
修課學期 Semester |
學分數 Credits |
每週上課時數 Hours per week |
備註 Remarks |
||
講授 Lecture |
實作(驗) Practice (laboratory) |
實習 Intern |
|||||||
學程核心課程39 學分 (39) Program Core Courses |
物理(一) | Physics(I) | 1st | 1st | 3 | 3 | |||
物理(二) | Physics(II) | 1st | 2nd | 3 | 3 | ||||
微積分 | Calculus | 1st | 2nd | 3 | 3 | ||||
半導體概論 | Introduction to Semiconductors | 1st | 2nd | 3 | 3 | ||||
電路學(一) | Electric Circuits (I) | 2nd | 1st | 3 | 3 | ||||
電路學實驗(一) | Electric Circuits Lab (I) | 2nd | 1st | 1 | 0 | 2 | |||
電子學(一) | Electronics (I) | 2nd | 1st | 3 | 3 | ||||
電子學實驗(一) | Electronics Lab (I) | 2nd | 1st | 1 | 0 | 2 | |||
工程數學(一) | Engineering Mathematics(I) | 2nd | 1st | 3 | 3 | ||||
工程數學(二) | Engineering Mathematics(II) | 2nd | 2nd | 3 | 3 | ||||
電子學(二) | Electronics (II) | 2nd | 2nd | 3 | 3 | ||||
電子學實驗(二) | Electronics Lab (II) | 2nd | 2nd | 1 | 0 | 2 | |||
電磁學 | Electromagnetism | 3rd | 1st | 3 | 3 | ||||
半導體製程 | Semiconductor Process | 3rd | 1st | 3 | 3 | ||||
半導體元件物理導論 | Introduction to Semiconductor Devices Physics | 3rd | 2nd | 3 | 3 |
類別 Category |
科目名稱 Course Title |
英文名稱 English Title |
修課年級 Year of the Program |
修課學期 Semester |
學分數 Credits |
每週上課時數 Hours per week |
備註 Remarks |
|||
講授 Lecture |
實作(驗) Practice (laboratory) |
實習 Intern |
||||||||
學程專業分組三擇一 Professional Track |
IC設計18學分
(18) IC Design Track |
數位系統 | Digital Circuits | 2nd | 1st | 3 | 3 | |||
FPGA程式設計 | FPGA Programming | 2nd | 1st | 3 | 3 | |||||
數位IC | Digital IC | 3rd | 1st | 3 | 3 | |||||
類比IC | Analog IC | 3rd | 1st | 3 | 3 | |||||
IC模擬理論 | IC Simulation Theory | 3rd | 2nd | 3 | 3 | |||||
IC合成 | IC Synthesis | 4th | 1st | 3 | 3 | |||||
固態半導體元件18學分
(18) Solid-State Semiconductor Devices Track |
半導體元件及應用 | Semiconductor Devices and Applications | 2nd | 2nd | 3 | 3 | ||||
半導體製程 |
Semiconductor Process | 2nd |
2nd |
3 | 3 | |||||
半導體材料與元件特性分析 |
Semiconductor Materials and Device Characterization | 3rd | 1st | 3 | 3 | |||||
半導體元件可靠度 | Reliability of Semiconductor Devices | 3rd | 1st | 3 | 3 | |||||
半導體設備系統實務 | Practical Semiconductor Equipment and Systems | 3rd | 1st | 3 | 3 | |||||
奈米級金氧半元件物理 | Physics of Nanoscale MOS Devices | 4th | 1st | 3 | 3 | |||||
半導體智慧製造15學分 (15) Semiconductor Smart Manufacturing |
作業研究 | Operation Research | 3rd | 1st | 3 | 3 | ||||
物料管理 | Material Management | 3rd | 1st | 3 | 3 | |||||
品質管理 | Quality Management | 3rd | 2nd | 3 | 3 | |||||
生產與作業管理 | Production and Operation Management | 3rd | 2nd | 3 | 3 | |||||
企業資源規劃 | Enterprise Resource Planning | 4th | 1st | 3 | 3 |
類別 Category |
科目名稱 Course Title |
英文名稱 English Title |
修課年級 Year of the Program |
修課學期 Semester |
學分數 Credits |
每週上課時數 Hours per week |
備註 Remarks |
||
講授 Lecture |
實作(驗) Practice (laboratory) |
實習 Intern |
|||||||
學程自由選修課程 Elective Courses | 大數據分析與應用 | Big Data Analytics and Applications | 1st | 2nd | 3 | 3 | |||
物聯網技術導論 | Introduction to IoT Technologies | 1st | 2nd | 3 | 3 | ||||
光電工程導論 | Introduction to Optoelectronic Engineering | 1st | 2nd | 3 | 3 | ||||
IC設計導論 | Introduction to IC Design | 2nd | 2nd | 3 | 3 | ||||
奈米科技導論 | Introduction to Nanotechnology | 2nd | 1st | 3 | 3 | ||||
電腦輔助設計 | Computer-Aided Design (CAD) | 2nd | 1st | 3 | 3 | ||||
儲能技術與應用 | Energy Storage Technologies and Applications | 2nd | 1st | 3 | 3 | ||||
感測器原理與應用 | Principles and Applications of Sensors | 2nd | 1st | 3 | 3 | ||||
平面顯示器 | Flat Panel Displays | 2nd | 2nd | 3 | 3 | ||||
真空與薄膜應用 | Vacuum and Thin Film Applications | 2nd | 2nd | 3 | 3 |
||||
機器人 | Robotics | 2nd | 2nd | 3 | 3 | ||||
固態物理導論 | Introduction to Solid State Physics | 3rd | 2nd | 3 | 3 | ||||
半導體功率元件 | Power Semiconductor Devices | 3rd | 2nd | 3 | 3 | ||||
先進封裝技術與實務 | Advanced Packaging Technologies and Practices | 3rd | 1st | 3 | 3 | ||||
半導體測試 | Semiconductor Testing | 3rd | 1st | 3 | 3 | ||||
寬能隙材料及元件 | Wide Bandgap Materials and Devices | 3rd | 1st | 3 | 3 | ||||
材料破損分析 | Failure Analysis of Materials | 3rd | 1st | 3 | 3 | ||||
循環經濟與永續發展 | Circular Economy and Sustainable Development | 3rd | 1st | 3 | 3 | ||||
奈米電子學 | Nanoelectronics | 3rd | 2nd | 3 | 3 | ||||
半導體記憶體技術 | Semiconductor Memory Technology | 3rd | 2nd | 3 | 3 | ||||
半導體元件模擬分析 | Simulation and Analysis of Semiconductor Devices | 3rd | 2nd | 3 | 3 | ||||
製造系統模擬 | Manufacturing System Simulation | 3rd | 2nd | 3 | 3 | ||||
積體電路系統與應用 | Integrated Circuit Systems and Applications | 4th | 1st | 3 | 3 | ||||
半導體產業設備系統設計 | Semiconductor Industry Equipment System Design | 4th | 1st | 3 | 3 | ||||
射頻積體電路設計導論 | Introduction to RF Integrated Circuit Design | 4th | 2nd | 3 | 3 | ||||
環境規劃與管理 | Environmental Planning and Management | 4th | 2nd | 2 | 2 |