Asia University (AU) College of Information and Electrical Engineering and Siliconware Precision Industries Co., Ltd. (SPIL), Taiwan’s leading IC packaging and testing company, have jointly launched the "2025 AU-SPIL Special Program: IC Packaging and Testing Equipment Training Curriculum." This program has been selected for inclusion in the Ministry of Economic Affairs Industrial Development Administration’s “Semiconductor International Linkage and Innovation Empowerment Program.” Enrollment is now open, and the course is fully subsidized. Approximately 70% of participants are expected to be matched with employment opportunities upon completion.

Dean of AU’s College of Information and Electrical Engineering, Dr. Ching-Hsien Hsu, stated that the program focuses on practical training in semiconductor packaging and testing equipment, guided by an expert mentorship system. The initiative aims to establish an integrated talent cultivation pipeline with a "learning-application alignment, skills-to-job matching, and direct-to-industry" model. Over the next three years, SPIL plans to expand its investment in central Taiwan, creating more than 8,000 job openings. This program serves as a strategic talent response to the region’s growing industrial demands and highlights AU's role as a regional hub for talent aligned with AI, smart manufacturing, and IC design.

Dr. Hsu emphasized that the program is designed with an “open-access, hands-on, job-ready” approach. It welcomes unemployed youth and career changers, especially those without a technical background. Moreover, a number of seats are reserved for women to promote gender diversity and sustainability in the semiconductor workforce. Participants will receive a completion certificate and may be matched with job opportunities at SPIL’s Taichung and Changhua facilities, ensuring a smooth transition into the global semiconductor industry.

The training runs from August 12 to August 22 at Asia University, with classes held Monday to Friday from 9 AM to 6 PM, totaling 50 hours. The curriculum features intensive hands-on sessions and mentorship by industry professionals, covering equipment operations, testing workflows, and key technical competencies. Practical projects and in-person instruction are designed to rapidly equip participants with workplace-ready skills, and with industry job-matching support, 70% of graduates are expected to secure employment.

“This is the perfect moment to enter the semiconductor field, as global demand continues to grow,” Dr. Hsu added. “Through this government-industry-academia collaboration, we aim to build a fast-track channel from training to employment, helping young people transform and upgrade their careers into essential semiconductor roles.”

Applications are open now through July 28, 2025. Interviews will be held on August 1. Interested individuals may apply online at https://asiapro.asia.edu.tw/AsiaPro or contact AU via email at ccs@asia.edu.tw with the subject line: "IC Packaging and Testing Equipment Training Program – Application Materials."

Program details available at: https://ccs.asia.edu.tw/zh_tw/IC_Courses