Certifications
Professional Certifications and Competency Development
The Semiconductor Program develops student competencies in semiconductor packaging and testing, processes and equipment, IC design and device simulation, smart manufacturing, and environmental, health, and safety management. Students may select appropriate certifications and professional training according to their academic interests and career goals.
MOEA Semiconductor Packaging and Testing Engineer Competency Assessment
An integrated assessment of packaging knowledge, equipment expertise, and hands-on operation skills
Assessment Subjects and Competencies
Assesses fundamental knowledge of semiconductor packaging, manufacturing processes, materials, quality control, and packaging equipment.
Assesses equipment principles, operating procedures, process control, basic troubleshooting, and operational safety.
Evaluates practical skills in wafer dicing, die bonding, and wire bonding equipment operation.
Passing and Certification Requirements
Asia University has established a hands-on IC packaging training environment featuring a Dicing Saw, Die Bonder, and Wire Bonder. The curriculum directly supports the packaging knowledge and practical machine-operation competencies required by this assessment. Actual subjects, passing standards, and certification rules remain subject to the latest official guidelines issued by the Industrial Development Administration, MOEA.
From Academic Training to Professional Certification
Additional Certifications and Professional Training
Students may select competency-development opportunities according to their curriculum pathway and career goals
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EDA Tools and IC Design Flow Practice
Training / Completion Program Recommendation
Covers circuit design, simulation, logic synthesis, timing analysis, verification, and physical layout within the IC design flow.
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Verilog / VHDL Hardware Description Languages
Training / Completion
Develops skills in digital logic, finite-state machines, testbenches, FPGA design, ASIC design, and functional verification.
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SPICE Circuit and Device Simulation Practice
Training / Completion
Covers transistor characteristics, operating-point analysis, transient analysis, AC analysis, parameter sweeps, and model interpretation.
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MOEA iPAS AI Application Planner
MOEA Competency Assessment Smart Manufacturing
Covers AI fundamentals, data processing, machine learning, and generative AI, with potential applications in semiconductor defect inspection, yield analysis, and predictive maintenance.
Official Information
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Vacuum Technology and Equipment Practice
Training / Completion Core Equipment Skills
Covers vacuum pumps, gauges, chambers, pumping systems, and leak diagnosis for sputtering, evaporation, etching, and equipment maintenance.
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ISO 14644 Cleanroom Fundamentals and
Internal Auditing
Training / Completion
Introduces air-cleanliness classification, particle monitoring, validation, contamination control, and cleanroom operating procedures.
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SPC, DOE, and Quality Engineering Practice
Training / Completion
Covers statistical process control, process capability, experimental design, variation analysis, and process optimization.
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ISO/IEC 17025 Measurement and Calibration
Fundamentals
Training / Completion
Develops an understanding of measurement traceability, equipment calibration, measurement uncertainty, and test-report interpretation. This is personnel training, not laboratory accreditation.
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PLC and Electromechanical Integration Practice
Training / Completion Equipment Engineering
Covers PLC programming, sensors, actuators, human-machine interfaces, automated control, safety interlocks, and troubleshooting.
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Predictive Maintenance and Equipment Diagnosis
Training / Completion
Applies vibration, temperature, current, and operational data to anomaly detection, equipment health assessment, and preventive maintenance.
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Helium Mass-Spectrometer Leak Detection
Hands-On Completion
Covers leak-detector operation, leak-rate interpretation, spray testing, vacuum testing, system inspection, and repair verification.
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MOEA iPAS Net-Zero Carbon Planning Manager
MOEA Competency Assessment Sustainable Manufacturing
Develops competencies in greenhouse-gas inventories, carbon management, and emissions reduction planning for green semiconductor manufacturing and sustainable supply chains.
Official Information
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IPC-A-610 Acceptability of Electronic Assemblies
International Certification Inspection Skills
Covers visual and quality-acceptance criteria for electronic assemblies and supports careers in module manufacturing, quality assurance, inspection, and failure analysis.
IPC Official Website -
IPC J-STD-001 Requirements for Soldered
Electrical and Electronic Assemblies
International Certification
Focuses on soldering materials, process control, and electronic-assembly requirements for manufacturing, process, and quality engineers.
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Asia University IC Packaging Equipment
Practical Training Certificate
University Training Assessment Preparation
Provides hands-on training using a Dicing Saw, Die Bonder, and Wire Bonder, including machine operation, process settings, safety checks, and basic troubleshooting.
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Reliability and Failure Analysis Practice
Training / Completion
Introduces temperature cycling, damp heat, thermal resistance, interfacial delamination, solder-joint failures, and packaging reliability analysis.
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ESD Control Professional Certification
International Certification
Develops competencies in ESD control programs, protected-area management, grounding, measurement, auditing, and personnel training.
Official Information -
SEMI S2 / S8 Equipment Safety and Ergonomics
Professional Training
Introduces semiconductor manufacturing-equipment safety, risk assessment, ergonomics, equipment design, and global supply-chain compliance.
SEMI Official Website -
ISO 45001 / ISO 14001 Internal Auditor Training
Training / Completion
Develops knowledge of occupational health and safety, environmental management, legal compliance, risk assessment, internal auditing, and continuous improvement.
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Chemical Safety and Regulatory Training
Regulatory Training
Covers chemical hazards, labels, safety data sheets, storage management, emergency response, personal protective equipment, and regulatory compliance.
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Semiconductor Process and Equipment Practice
Program-Based Practice
Integrates thin films, vacuum systems, plasma processes, metrology, process control, and cleanroom safety to establish process and equipment engineering fundamentals.
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Integrated Semiconductor Packaging and
Testing Practice
Program-Based Practice Career-Oriented
Integrates wafer dicing, die bonding, wire bonding, packaging quality, electrical testing, and basic failure analysis.
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AR / VR Packaging Equipment Training
Immersive Learning
Uses immersive learning to introduce equipment structures, standard operating procedures, operational risks, and troubleshooting scenarios.
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Industry Co-Teaching and Practical Assessment
Industry–Academia Training
Industry engineers participate in equipment demonstrations, process-experience sharing, practical training, and competency assessment.
Suggested Certification and Competency Pathway
- Stage 1 | Build the Foundation Semiconductor packaging fundamentals, vacuum technology, cleanroom fundamentals, Verilog/VHDL, and laboratory safety.
- Stage 2 | Develop Practical Skills Three-machine packaging practice, SPC/DOE, PLC, SPICE simulation, ESD control, and reliability analysis.
- Stage 3 | Pursue Professional Credentials Prioritize the MOEA Semiconductor Packaging and Testing Engineer Competency Assessment, followed by IPC, iPAS, or EHS-related credentials according to career goals.
