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External Engagement
INDUSTRY COLLABORATION
Industry Collaboration and Career Development
By integrating the resources of enterprises, research institutes, and industry organizations, the Program provides industry mentors, collaborative projects, hands-on equipment training, company visits, talent-development programs, and career-matching opportunities. Students are prepared for careers in IC design, semiconductor processing, equipment engineering, packaging and testing, and smart manufacturing.
1. Core Collaboration Models
- Industry Mentors Industry engineers provide technical insights, project guidance, periodic feedback, and career consultation, helping students understand actual industry requirements.
- Industry–Academia Projects Students address real-world industrial scenarios through project planning, experimentation, fabrication, measurement, and validation, producing demonstrable technical outcomes.
- Industry Visits Students visit organizations involved in wafer manufacturing, equipment, materials, packaging, and metrology to understand production workflows and workplace safety requirements.
- Practical Training Environments On- and off-campus equipment, the IC Packaging Quasi Production Line, and AR/VR learning resources connect academic knowledge with practical workplace skills.
2. Project Schedule and Student Outcomes
First Half of the Semester
Project matching, confirmation of industry needs, project planning, fundamental training, equipment safety, and experimental risk assessment.
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Second Half of the Semester
Experimental implementation, technical validation, data analysis, outcome integration, presentations, and portfolio development.
Student Deliverables
- Project reports and professional portfolios
- Measurement data and analytical methods
- Industry mentor feedback and career connections
3. Career-Oriented Guidance
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Curriculum–Industry Alignment
Course content is updated according to semiconductor industry development, employer competency requirements, and emerging equipment technologies.
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Mock Interviews and Résumé Workshops
Faculty members and industry experts help students organize project achievements, technical competencies, résumés, and interview presentations.
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Career Guidance and Job Matching
Corporate training, campus recruitment, internships, collaborative projects, and employment interviews provide multiple pathways into the industry.
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International Career Perspectives
Overseas study, multinational team engagement, and international industry–academia projects strengthen cross-cultural communication and global competitiveness.
4. Participation and Application Process
- Apply according to Program or course announcements
- Complete faculty eligibility and pathway review
- Enter company, project, or internship matching
- Complete training and outcome assessment
5. Industry and Institutional Engagement
Connecting the Semiconductor Value Chain with Cross-Disciplinary Research Resources
The Program maintains active engagement through company visits, campus visits, equipment and technology exchange, industry–academia projects, vocational interviews, talent development, and memoranda of understanding.
30+ Recent engagement records
4 Primary engagement models
3 Core IC packaging machines
2025–2026 Recent engagement period
Company Visits Technology, talent needs, and industrial operations
Campus Visits Curriculum, equipment, and talent-development discussions
Talent and Careers Training, interviews, internships, and job matching
Collaborative Development MOUs, quasi-production lines, projects, and R&D
Semiconductor Manufacturing, Packaging, and Testing
TSMC Wafer manufacturing and talent-development engagement
Micron Technology Memory technology, talent, and career engagement
Siliconware Precision Industries Co., Ltd. (SPIL) Packaging, equipment, quasi-production line, and talent development
Lingsen Precision Industries, Ltd. Packaging, testing, vocational training, and recruitment
Equipment, Materials, Optoelectronics, and Automation
Lam Research Semiconductor equipment
Taiwan Diamond Materials Co., Ltd. Advanced materials and technology exchange
有家科技 Technology and industry engagement
迎璟科技 Technology and industry engagement
威亞精密 Precision technology engagement
詠宸科技 Technology and industry engagement
華立捷科技 Equipment and technology engagement
富臨科技 Industry collaboration and MOU
Contrel Technology Co., Ltd. Equipment and automation technology
立陽光電 Optoelectronics engagement
Calin Technology Co., Ltd. Optics and precision manufacturing
悅懋科技 Technology and industry engagement
赫旺國際 Industry engagement
Research Institutes and Industry Organizations
Metal Industries Research & Development Centre MIRDC
ITRI Mechanical and Mechatronics Systems Research Laboratories
Taiwan Instrument Research Institute National Applied Research Laboratories
Precision Machinery Research & Development Center PMC
National Taiwan Craft Research and Development Institute
Taiwan Textile Research Institute TTRI
Changhua Coastal Industrial Park Service Center
International and Interdisciplinary Engagement
Rizom and Microlab Teams, the Netherlands International technology and research exchange
柏泰生醫 Biomedical and interdisciplinary applications
Other Industry and Technology Teams Updated according to annual projects and engagement activities
6. Recent Company Visits and Engagement Records
| Date | Organization and Activity | Engagement Type |
|---|---|---|
| 2026.07.08 | Visit by SPIL engineers | Campus Visit |
| 2026.07.06 | Lingsen Precision conducted vocational-training interviews at Asia University | Talent Program |
| 2026.06.26 | Visit by Director Meng-Fan Chang and the TSMC team | Campus Visit |
| 2026.06.25 | Visit to Micron Technology | Company Visit |
| 2026.06.24 | Visit to 有家科技 | Company Visit |
| 2026.06.17 | Visit to the Metal Industries Research & Development Centre | Institute Visit |
| 2026.05.26 | Campus visit by Taiwan Diamond Materials and 有家科技 | Campus Visit |
| 2026.05.25 | Visit by Director Cheng-Chieh Kao of Lam Research | Campus Visit |
| 2026.05.22 | Visit by Dr. Chang-Hsin Yeh of MIRDC | Institute Visit |
| 2026.04.14 | Visit to 威亞精密 | Company Visit |
| 2026.04.10 | Visit to 詠宸科技 | Company Visit |
| 2026.03.23 | Visit by Vice President An-Ping Chiu of 華立捷 | Campus Visit |
| 2026.03.19 | Engagement with the National Taiwan Craft Research and Development Institute | Institute Exchange |
| 2026.03.19 | Signing of an MOU with 富臨科技 | MOU |
| 2026.03.17 | Visit by 赫旺國際 | Campus Visit |
| 2026.03.12 | Opening ceremony for the SPIL IC Packaging Quasi Production Line | Joint Event |
| 2026.02.11 | Online engagement with SPIL and the Industrial Development Administration, MOEA | Online Exchange |
| 2026.02.09 | Engagement with the Changhua Coastal Industrial Park Service Center | Industry Exchange |
| 2026.02.06 | Visit to Lam Research | Company Visit |
| 2026.02.03 | Visits to Taiwan Diamond Materials, 有家科技, 迎璟科技, and MIRDC | Industry Visits |
| 2026.01.30 | Visit by Advisor Hsin-Yuan Tsai of MIRDC | Institute Visit |
| 2026.01.29 | Engagement with 悅懋科技 and 立陽光電 | Industry Exchange |
| 2026.01.20 | Engagement with 富臨科技 and Taiwan Diamond Materials | Industry Exchange |
| 2026.01.09 | Engagement with Contrel Technology | Industry Exchange |
| 2026.01.08 | Engagement with SPIL | Industry Exchange |
| 2025.12.30 | Engagement with ITRI Mechanical and Mechatronics Systems Research Laboratories | Technical Exchange |
| 2025.12.26 | Engagement with Rizom and Microlab teams from the Netherlands | International |
| 2025.12.02 | Engagement with the Taiwan Instrument Research Institute | Technical Exchange |
| 2025.11.20 | Engagement with the Taiwan Textile Research Institute | Interdisciplinary |
| 2025.11.11 | Engagement with 柏泰生醫 | Interdisciplinary |
| 2025.10.30 | Engagement with Calin Technology | Industry Exchange |
| 2025.10.28 | Engagement with the Precision Machinery Research & Development Center | Technical Exchange |
This section presents records of company and institutional visits, technical exchanges, talent-development activities, and collaborative initiatives. The form and progress of engagement vary by organization. Inclusion in this section does not mean that every listed organization has entered into a formal cooperation agreement with the University.
7. Company Visit and Engagement Overview
