View count: 1085

Overview

🚀

Program Vision and Establishment

       Asia University officially established the Bachelor Degree Program in Semiconductors in August 2026 in response to the national semiconductor industry development policy and global technological trends. The program's design is highly innovative, centrally integrating critical interdisciplinary resources from Electrical Engineering, Information Technology, Materials Science, and Management. The curriculum covers core technologies such as semiconductor processing, device physics, chip design, and packaging and testing, and introduces practical industry projects and corporate internship mechanisms to systematically cultivate high-level semiconductor application talents who possess a solid theoretical foundation, advanced practical skills, immediate industry readiness, and an international market perspective.

💡

Core Educational Goals

       The program is guided by the core philosophy of "Solid Academics x Practical Orientation x Industry Alignment x Sustainable Innovation." It is committed to nurturing professionals who can demonstrate innovation and leadership across all phases of the semiconductor industry (IC Design, Wafer Fabrication, Packaging and Testing, Smart Applications), thereby creating a new generation of highly competitive high-tech talent with international competence.

 

Faculty Team Characteristics

  • The faculty team comprises experts and scholars from fields including Electrical Engineering, Electronic Engineering, Information Technology, and Materials Science, possessing both practical industry experience and strong academic research capabilities.
  • Most faculty members have previously worked in well-known domestic and international technology companies and research institutions, giving them rich R&D and management experience and a precise grasp of industry technical trends.
  • The team is actively involved in long-term collaborative research projects funded by the National Science and Technology Council (NSTC) and inter-university partnerships, promoting technological innovation in semiconductor processing, IC design, and AI smart manufacturing.
  • Many faculty members have dual backgrounds as engineers and researchers, emphasizing the cultivation of practical skills and problem-solving abilities, and incorporating corporate mentorship and specialized project practice.
  • The teaching philosophy emphasizes "Learning by Doing, Innovating through Learning," laying a solid foundation for entering the industry or pursuing graduate studies.
 
 
Design and Process Integration

Integrating IC design, device physics, and process integration techniques for application in chip development and process optimization.

Interdisciplinary Integration and Applications

Combining AI, materials, information technology, and green energy technologies to develop smart manufacturing and sustainable semiconductor applications.

Equipment Operation and Testing

Familiarity with process and measurement equipment operation, possessing professional skills in materials analysis, wafer testing, and device failure analysis.

Teamwork and Global Perspective

Cultivating cross-cultural communication and global competitiveness through capstone projects, industry internships, international exchange, and English-taught courses.

Practical Environment and Industry-Academia Resources

The program is based on the "Research Center for Smart Semiconductor Design and Sustainable Manufacturing," which provides a comprehensive experimental and teaching environment, offering students diverse spaces for practical training and R&D.

Key Laboratories:
  • Chip Design Lab, Process and Clean Room, Packaging and Testing Lab, Optoelectronic Measurement Lab.
Core Equipment:

Sputtering system, photolithography aligner, annealing furnace, spectral analyzer, Hall measurement system, Probe Station (wafer prober), functional IC testing equipment, high-precision electrical characterization platform, and advanced process training modules.

The experimental environment supports the entire workflow from device fabrication, packaging/testing to system integration.

Industry-Academia Collaboration and Internships:

The program actively promotes industry-academia collaboration and internship programs, establishing partnerships with various domestic and international enterprises and institutional research bodies. This provides students with opportunities to participate in real projects, access the latest industry technologies, and cultivate immediate professional competence (industry readiness).

Program Introduction Video and Future Outlook
 

       The Semiconductor Program at Asia University aims to build a forward-looking teaching and research environment that deeply aligns with future industry trends, particularly the demand for high-performance, low-power chips in applications such as Artificial Intelligence (AI), Internet of Things (IoT), and Green Energy. The program actively promotes industry-academia collaboration, ensuring the curriculum is synchronous with industry needs, allowing students to possess immediate job-ready professional skills upon graduation. By leveraging resources from the "Research Center for Smart Semiconductor Design and Sustainable Manufacturing," students will not only master the hardware knowledge of chip design and processing but also integrate software and application aspects across disciplines. They will become the new generation of semiconductor talent with international competitiveness and a sustainable innovation mindset, contributing to technological development in Taiwan and globally.