Asia University will host a “Semiconductor Packaging Production Line Platform Establishment Announcement” event this Thursday (March 12) at 4:30 p.m. in Harvard Lecture Hall A116. Representatives from Siliconware Precision Industries Co., Ltd. will also participate in the event.

According to the university, the event will introduce the concept and future development of the semiconductor packaging production line platform. Through industry–academia collaboration, the initiative aims to connect industrial expertise with academic research and help faculty and students better understand semiconductor packaging technologies and industry trends.

Asia University noted that it will continue to promote collaboration with industry partners to strengthen semiconductor talent development and practical applications. The event is open to faculty, staff, and students across the university.