Semiconductor Exhibition Visit Report: Focusing on Industry Trend Observations
Visit Content and Key Industry Trends
1. Industry Trend Observations
- Advanced Packaging Technology: Focusing on the latest developments and breakthroughs in advanced packaging technologies such as CoWoS, 3D IC, and SiP, which are crucial for supporting AI and High-Performance Computing (HPC).
- Third-Generation Semiconductor Applications: Observing the widespread application and growth potential of third-generation semiconductors like Silicon Carbide (SiC) and Gallium Nitride (GaN) in electric vehicles, charging piles, and high-efficiency power management.
- Driven by AI and HPC: Observing that Artificial Intelligence (AI) and High-Performance Computing (HPC) demand higher capacity and technology from wafer fabrication, packaging, and testing, serving as the main drivers for rapid industry growth.
Summary
This visit primarily focused on grasping the latest trends in the semiconductor industry, specifically "Advanced Packaging, Third-Generation Semiconductors," and the "driving impact of AI applications on the entire supply chain." Observations from the exhibition confirm that high-end packaging and heterogeneous integration are the core focus of future technological development, and the mature application of third-generation semiconductors in the electric vehicle sector is also noteworthy. The findings from this observation will serve as important references for Asia University's future directions in curriculum design, research projects, and industry-academia collaboration.
