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International Foundation Program

ACADEMIC YEAR 116 · INTERNATIONAL FOUNDATION PROGRAM

International Foundation Program

Begin with Chinese language preparation, then continue into bachelor’s degree study.
Learn across chip design, materials and processes, packaging, and testing.

Globe, wafer, and schematic routes to Asia University and semiconductor destinations
Schematic: students come to Asia University from around the world, then continue toward semiconductor industry destinations.

The Bachelor Program of Semiconductor will be included in Asia University’s International Foundation Program admissions for Academic Year 116. This program is built around the complete semiconductor value chain—IC design, materials and processes, packaging, and testing—so students begin with shared foundations and then explore the direction that best matches their interests. Eligible Overseas Chinese, Hong Kong and Macao students, and international students are welcome to apply.

Chinese preparation first, then bachelor’s study

Asia University’s International Foundation Program follows a 1+4 structure: students spend the first year in intensive Chinese language preparation and must obtain TOCFL A2 or above before progressing into a four-year bachelor’s program. After entering degree study, students continue to strengthen their Chinese proficiency according to IFP requirements. Eligibility, schedule, tuition, and scholarships are subject to announcements by the International Foundation Program and the University.

YEAR 1
Chinese Foundation
Intensive Chinese courses prepare students for academic study and daily life before they enter the bachelor’s program.
PROGRESSION
TOCFL A2 or above
Students must obtain TOCFL A2 or above by the end of the foundation year to continue into four-year degree study.
YEARS 2-5
Semiconductor Degree
After meeting the language requirement, students enter this program to study chip design, materials and processes, packaging, and testing.

Admission quotas shared by three departments

Shared IFP quotas of three departments
The figures below are combined totals, not this program’s own quota.
Shared
Overseas Chinese / Hong Kong / Macao
66 places
Shared
International students
177 places
Shared
Combined total
243 places
Participating units: the Department of Food Nutrition and Health Biotechnology (Food Nutrition Group), the Department of Healthcare Administration, and the Bachelor Program of Semiconductor.
Final admissions information, eligibility, and schedule are subject to the official admission brochure and University announcements.

About the Bachelor Program of Semiconductor

Semiconductors are not a single discipline. They connect electronics, information technology, materials, processes, mechanics, measurement, and system integration. Students begin with common foundations and gradually build interdisciplinary understanding and practical capability.

UPSTREAM
IC Design
Planning and verifying chip circuits according to functional needs is a key upstream stage of the semiconductor value chain.
MATERIALS & MANUFACTURING
Materials and Processes
Materials are processed step by step into devices and chips, including thin films, lithography, etching, measurement, and integration.
BACKEND
Packaging and Testing
Packaging makes a chip usable, protected, and thermally manageable; testing confirms electrical performance, function, and reliability.
TRACK 01

Semiconductor Devices & Design

This track is suitable for students interested in electronic devices, circuit logic, chip design, and intelligent systems. Starting from device characteristics, students explore how chips support computing, sensing, memory, and system control.

Students learn foundational concepts in semiconductor devices and electronic systems, develop circuit, design-logic, and simulation thinking, and understand how chip design connects with intelligent applications.

TRACK 02

Semiconductor Materials & Process

This track is suitable for students interested in materials, chemistry, physics, precision manufacturing, and hands-on practice. Beginning with materials and processes, students learn how chips are manufactured, packaged, measured, and verified.

Students learn foundations in semiconductor materials, thin films, processes, and measurement; understand packaging, testing, and reliability; and build observation, operation, data-interpretation, and problem-analysis skills.

Hands-on learning environments

Learning is connected to practice. Under faculty guidance and safety rules, students may use semiconductor analysis and measurement equipment, the IC Packaging Quasi Production Line, AR/VR classrooms, and related teaching platforms. AR/VR resources help students understand process flow, equipment structure, and operating safety before they work with the instruments.

Where can this lead after graduation?
Depending on individual strengths, students may move toward semiconductor processing, equipment, packaging, testing, materials, quality assurance, research and development, or related technology industries. They may also use courses, projects, and research participation to prepare for graduate study. Career and further-study outcomes depend on each student’s learning and the opportunities available at the time.

Program Features Curriculum Facilities Faculty

International Foundation Program Office of International Affairs

The Academic Year 116 admission brochure, eligibility, schedule, tuition, and scholarships will be updated according to University and IFP announcements. Program office: +886-4-2332-3456 ext. 6315. For IFP admissions inquiries, please contact the Office of International Affairs.
Asia University · Bachelor Program of Semiconductor